Testing services / Methods / Competencies

• X-ray determination of residual stresses, stress distributions and residual stress depth profiles on components
• Measurements in the laboratory or directly at the customer's site using mobile X-ray diffraction (XRD)
• Precise quantitative stress analysis on metals, coatings and coating-substrate systems
• Experience with complex component geometries, manufacturing processes and thermomechanical loads
• Determination of the relaxation of residual stresses at elevated temperatures up to 900°C

Specific technical features & information

• Analysis of near-surface residual stresses
• Depth profiles through stepwise material removal (e.g. electrochemical)
• Investigation of residual stress development in layer/substrate composites during temperature changes
• Determination of residual stress relaxation at elevated temperatures up to 900°C

Advantages & industrial benefits

• Early detection of critical stress conditions to prevent cracking, distortion or component failure
• Safeguarding of manufacturing, heat treatment and coating processes

Typical applications / examples

• Analysis of weld seams, coatings and surface layers
• Assessment of thermal influences during heat treatment, coating processes or operating temperatures
• Support with damage analyses and service life estimates
• Process optimisation in mechanical engineering, plant construction and toolmaking

Cut-Compliance Method

Determination of residual stresses within the component volume, especially at greater depths.

Your benefits:

• Determination of subsurface/depth stresses (mm–cm range)

• Complements surface-based methods (e.g. X-ray)

• Flexible use for various materials and component geometries

• Validation of numerical stress analyses

Residual Stress Measurements Using Raman Spectroscopy

• Extremely high spatial resolution (down to < 1 μm) – ideal for micro- and nanoscale structures
• No electrical or mechanical contact required
• Temperature range from –196 °C to 600 °C
• Enables simultaneous determination of stresses and phases

Residual Stress Measurements Using Electron Microscopy

• Measurement of residual stresses and residual stress depth profiles in coatings with depth resolution down to 10 nm

• Temperature-dependent residual stress measurements of microelectronic layers between –180 °C and +400 °C

• 2D residual stress distributions in crystalline materials with accuracy in the range of a few tens of nanometres, including dislocation density analysis

• Residual stress depth profiles on machined sheets, wires, and other surfaces