The microelectronics laboratory focuses on the analysis and reliability testing of electronic components and assemblies. Equipped with inspection and test systems combined with SEM/EDX analytics, we examine material quality, defects, and interconnect reliability – from the surface down to the nanostructure.

• Computed tomography (Nanotom) for non-destructive 3D analysis.
• Confocal UV Raman microscope (Witec alpha300R) for chemical and structural characterization.
• Bond testers (SigmaCondor) and μDMA (RSA-G2) for interconnect and material reliability.
• Temperature testing technology: climatic cycling chambers, shock chambers for extreme testing.
• Electrical analysis: TF Analyzer 3000, TDTR PicoTR, PU/SMU/frequency generators.
• Scanning probe microscope (Semilab) for nanoscale surface analysis.
• Precision sample preparation with Leica TXP EM.

👉 High-tech for micro- and nanoelectronics – comprehensive, precise, and application-oriented.