SAM (Scanning Acoustic Microscopy)
Scanning Acoustic Microscopy (SAM) enables non-destructive inspection of internal structures and defects in materials and electronic components. By using ultrasonic waves, delaminations, cracks, and inclusions can be detected with high depth resolution. This technique is particularly valuable for quality control and reliability analysis in microelectronics and materials testing.
Non-destructive, ultrasound-based imaging.
Reconstruction of internal structures and defects.
Our focus areas / expertise
Failure analysis
Analysis of components and materials
Target/actual comparisons