Materials Center Leoben Forschung GmbH
Business Area Services

Materials Testing of Microelectronic Systems

The mechanical characterization of electronic systems, their components, and interconnect technologies is crucial to ensure reliability and lifetime under real operating conditions. By analysing mechanical loading of solder joints, PCBs, and housings, weak points can be identified and both design and material selection can be specifically improved. This ensures that the mechanical stability of components and connections is optimally aligned with the electrical functionality of the overall system.

Mechanical Testing / Bond Testing

We characterize the mechanical properties of materials used for manufacturing microelectronic components as well as simple and complex assemblies.

Our focus and expertise

  • Determination of interfacial strength in various materials, e.g. by shear tests, pull tests, or wedge tests
  • Reliability tests (creep tests, cyclic loading)
  • Characterization of wire bonds (pull tests on wires from 20 to 400 μm diameter, shear tests, etc.)
  • 3-point and 4-point bending tests up to 1000 N for a wide range of materials (e.g. wafers, PCBs, etc.)

Dynamic Mechanical Analysis

Dynamic mechanical analysis (DMA) characterizes the viscoelastic or “rheological” properties of solids and liquids.

Our focus and expertise

  • Creep and creep recovery
  • Stress relaxation
  • Stress ramps
  • Shear rate ramps
  • Iso-strain and iso-stress tests
  • Fatigue tests with freely defined waveforms